SERVICES PCB Assembly Surface Mount (SMT) Capabilities: SMD component sizes from 01005, 0201 and 0402 packages, etc. to µBGA and BGA (ball grid array), QFN and fine pitch devices Vibrant Automatic Through-hole Soldering Technology AOI Inspection - Advanced 3D Optical Inspection, inspecting PCBA for paste, pre-reflow and post-reflow Device Programming: Component preprogramming or in-circuit programming Conformal Coating In-circuit Testing (ICT) Functional Circuit Testing (FCT): Custom fixtures
Universal Fine Pitch Pick-n-Place Machine